New Cycle of Computing Infrastructure, Liquid Cooling Pipeline Components Enter Mass Application Phase

In recent times, AI computing infrastructure keeps evolving. With gradual increases in chip power consumption, liquid cooling solutions see wider adoption in high-density computing clusters. Orders across the industrial chain are released in an orderly manner, bringing new development opportunities for full-range liquid cooling components.

As new-generation AI platforms move forward, power density per cabinet continues to rise. Traditional air cooling has limitations when supporting long-term stable operation of high-power chips. Industry statistics show that China’s liquid cooling data center market maintains growth in 2026. Leading liquid cooling equipment suppliers hold sufficient orders and keep stable production on multiple production lines, and project delivery cycles draw attention from the industry. Among technical routes, cold-plate liquid cooling stands out for convenient maintenance and compatibility with existing computer room retrofits, making it the mainstream deployment solution. Supporting components including CDU, manifold, liquid cooling hoses and UQD quick connectors serve as key parts to guarantee stable system operation. Reliability, medium resistance and sealing performance are core factors for customers during product selection.

Recent industry updates show that AMD has released the Helion AI rack design. The rack supports both air cooling and liquid cooling options, with joint backing from eight manufacturers including Dell, Lenovo and Hon Hai. It is scheduled to launch in November 2026, offering more liquid cooling deployment options for enterprise computing scenarios. The updated NVIDIA MGX 1.2 standard adds blind-mate liquid cooling specifications for racks. Liquid cooling interfaces can connect automatically when trays slide into cabinets, simplifying on-site construction and lowering leakage risks caused by manual operations. This new standard will drive the standardization upgrade of liquid cooling pipelines and connectors, improving the delivery efficiency of liquid cooling projects. Overseas, multiple liquid cooling enterprises expand megawatt-level test labs to verify two-phase liquid cooling solutions for next-generation high-power AI cabinets, making technical preparations for future megawatt-level cabinet thermal management.

Positive signals also emerge within the domestic industrial chain. Several listed companies have released performance forecasts. Revenue from liquid cooling data center businesses sees gradual realization, and upstream suppliers of materials and refrigeration equipment record improved performance alongside the expansion of liquid cooling projects. Industry participants agree that the market focus has shifted from solution verification to large-scale batch delivery. When selecting suppliers, customers pay close attention to long-term component stability, batch delivery capacity and full-life-cycle supporting services.

As a service provider focused on fluid pipeline accessories for liquid cooling, Jiayida (KRES) keeps pace with industry trends. We supply a full set of liquid cooling pipeline parts including Continental hoses, hose clamps and quick connectors. These products fit the primary and secondary circulation pipelines of cold-plate liquid cooling data centers, and deliver mature and reliable fluid connection solutions for main inlet and return pipelines. We continuously optimize product selection and delivery systems to meet demands for new computing center construction and liquid cooling retrofits of existing computer rooms, helping clients build safe, stable and efficient liquid cooling thermal management systems. Moving forward, the company will continue to deepen its presence in the liquid cooling fluid accessory sector, align with industry standardization progress and provide reliable pipeline supporting solutions for more data center customers.

Jiayida (Suzhou) Fluid Power Technology Co., Ltd. focuses on providing one-stop liquid cooling fluid system solutions and services for data center scenarios. The product portfolio covers OCP-standard UQD, UQDB and BMQC quick disconnect couplings, water manifold assemblies, Continental EPDM hoses and hose assemblies, FF9 full-flow double interlock quick disconnect ball valves as an alternative to FD83 series products, API heat exchangers, Gates data center-dedicated EPDM hoses, as well as WIKA pressure gauges and sensors from Germany.

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