H3C, a subsidiary of Unisplendour Corporation, is deepening its strategic layout in the liquid cooling industry to provide "cool" support for high-density computing power.

1.Liquid cooling technology has become the critical path for high-density computing power, and H3C is practicing the 'ALL in GREEN' philosophy

H3C Group, a subsidiary of Unisplendour Corporation, upholds the 'ALL in GREEN' philosophy and has comprehensively laid out liquid cooling technologies. It offers multiple technical routes including cold plate, immersion, and spray technologies, committed to building full-stack liquid cooling solutions with advanced technology and excellent performance. Additionally, it has launched liquid-cooled full cabinet product series targeting the fields of AI computing and intelligent scientific computing.Among them, for the training and inference scenarios of MoE large models, H3C's newly released H3C UniPoD S80000 super node product, leveraging full cabinet liquid cooling technology, can be configured with up to 64 AI accelerator cards per cabinet. The maximum power of the entire cabinet reaches 120kW, with key components adopting liquid cooling for heat dissipation, featuring both high efficiency and green attributes.

  As shown in the figure, the S90000 high-density liquid-cooled full cabinet solution is on the left side of the picture, and the S80000 AI liquid-cooled full cabinet solution is on the right side.

2.Air-liquid hybrid cooling + intelligent protection system: H3C's liquid-cooled full cabinets drive the green transformation of computing infrastructure.

In terms of thermal design, H3C's liquid-cooled full cabinets adopt an 'air-liquid hybrid' solution. Integrated cold plates cover key heat-generating components such as CPUs, GPUs, and memory, with liquid cooling accounting for over 75% of heat dissipation. They can also be paired with liquid-cooled back doors to further enhance heat dissipation efficiency.This solution significantly improves energy efficiency, helping reduce the PUE of data centers to below 1.2 and effectively lowering lifecycle costs. The optimized water circuit design enables precise adjustment of coolant parameters, lowering GPU temperatures by over 20°C.For traditional computer room environments, the full cabinets are equipped with customized air-liquid CDUs, enabling rapid deployment in conventional air-cooled environments without the need to modify primary-side infrastructure—balancing high-efficiency heat dissipation and deployment flexibility.

In terms of system reliability, H3C's liquid-cooled full cabinets have built a comprehensive liquid leakage protection system. High-precision liquid leakage detection devices are deployed on the cabinet side and inside the nodes, featuring functions for detecting liquid leakage, wire breakage, and presence, with a detection accuracy of less than 0.5 ml. The entire cabinet is equipped with a complete liquid leakage drainage channel, which can accurately guide the flow to avoid affecting motherboard operation.Meanwhile, a two-layer out-of-band management architecture is built through RMC (Rack Management Controller) and BMC (Baseboard Management Controller), enabling system monitoring and O&M (Operations and Maintenance) management at both cabinet-level and node-level. RMC is integrated into the power module to uniformly manage and control power supply, heat dissipation, environment, and liquid cooling systems; BMC is responsible for node status monitoring, supporting fault early warning and log positioning of key components, thus improving the intelligence level of O&M.During the production phase, the product achieves 88% automated manufacturing of single boards and a 96% intelligent manufacturing first-pass yield. Relying on factory pre-integration and full-cabinet transportation modes, it significantly improves delivery efficiency and enables out-of-the-box use, providing stable and reliable infrastructure support for high-density computing scenarios.

3.Optimize the layout of the liquid cooling industry and establish a complete capability closed loop from innovative technology R&D to design, manufacturing and delivery.

Facing the growing demand for large-scale, high-density computing power, H3C—one of the few domestic manufacturers with full-process capabilities in designing, manufacturing, and large-scale delivery of liquid-cooled full cabinets—continues to optimize its liquid cooling industry layout. Building on its existing production capacity, it is actively constructing larger-scale production lines to meet the explosive growth of market demand.The new production line is expected to officially start production in the first quarter of 2026, at which point the total production capacity will reach a delivery capability of thousands of cabinets per year.

Kres(Suzhou) Power Systems Technology Co., Ltd is an emerging company focused on fluid power solutions, and serve for the markets of Energy, Construction, Agriculture, Manufacturing, Transportation, Medical, Data Centers, etc., and was founded in 2022 with leading-edge engineering capabilities and innovative products to keep up with the changing customer needs. Including OCP standard UQD, UQDB, BMQC, manifold, EPDM hose and hose assemblies, FF9 full flow dual interlock quick disconnect coupling (a better replacement for FD83 series products), API heat transfer products, Gates EPDM hose and Wika products.

KRES FF9 connectors are specifically engineered for fluid transmission, electronic cooling, and data center liquid cooling applications, where full flow, fluid compatibility, and safety are of paramount importance. The FF9 series ball valve quick-disconnect couplings adopt a full-flow design and are now available in 2-inch, 1.5-inch, and the popular 1-inch sizes. The FF9 double interlock liquid cooling quick-change connector features a swivel structure at its tail, facilitating easy connection and disconnection. Additionally, its two connector halves are completely identical, simplifying maintenance, installation, and service processes.

· 100% full-flow interlock ball valve: The FF9 double interlock ball valve has a diameter of up to 21mm, ensuring large flow while reducing pressure drop, achieving large flow and low pressure drop, and has obtained SGS ROHS reports and Huace performance test reports.

· KRES interlock ball valve adopts a double interlock design with two locking mechanisms to prevent accidental disconnection and ensure data security.

· The FF9 liquid cooling quick-change ball valve has identical connector halves, making maintenance, installation, and service simple.

· As a liquid cooling quick-change ball valve for data centers, it has reliable and stable performance with minimal leakage, meeting the maintenance needs of safe machine relocation or shutdown.

· Standard body material of the liquid cooling quick-change connector: 304 stainless steel, with wide fluid compatibility, and other materials can be provided upon request.

· Standard sealing material of the liquid cooling quick-change connector: EPDM ethylene propylene diene monomer synthetic rubber, and other materials can be provided upon request.

· Operating temperature range of the liquid cooling-specific ball valve: -40℃ ~ 120℃