2025-10-22 17:45:02
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1.AMD Secures Big Deals for Computing Power; High-End Chips Are Fully Secured by Clients
Recently, AMD, a leading AI chip giant, has been frequently rolling out moves in the AI market. It first announced a cooperation agreement totaling 6GW (gigawatt) with OpenAI, where OpenAI has positioned AMD as its core strategic computing partner. This partnership will drive the large-scale deployment and application of AMD's technologies, injecting robust computing momentum into OpenAI's next-generation AI infrastructure. Among the plans, the deployment of the first-phase 1GW AMD Instinct MI450 GPUs is expected to kick off in the second half of 2026.
Subsequently, AMD secured an order for 50,000 chips with Oracle. Starting from the third quarter of next year, Oracle will deploy 50,000 AMD MI450 chips in its operated data centers, and this cluster will utilize computing power equivalent to 200 megawatts. The two companies stated that they plan to expand their partnership in 2027 and beyond. Meanwhile, at last week's OCP Summit, Meta also showcased the MI450 super-node AI full rack developed in collaboration with AMD. This is a product that AMD will launch next year, and samples have been gradually delivered to North American CSP (Cloud Service Provider) vendors.

Based on recent market information, AMD has achieved remarkable results in the AI market. Although its order volume lags behind NVIDIA, the pace of its market development is no slower than that of NVIDIA.
2. Direct competition between AMD and NVIDIA
In the current global high-end AI chip market, NVIDIA holds over 90% of the global high-end AI chip market share, almost monopolizing the entire market with no competitors of the same tier worldwide. Intel, which competed with NVIDIA in the early days, has gradually faded out of the market. Previously, AMD also had relatively little say in the AI chip sector. After a period of accumulation, AMD has 'made a comeback' with its newly launched MI350 chip, whose performance is on par with the GB200.
NVIDIA's launch rhythm
MD's chip launch cadence
In 2026, AMD's MI450 is expected to directly compete with the Vera Rubin series of server chips developed by Nvidia, which is AMD's main competitor and the undisputed leader in AI chip design.
3. The relationship between AMD's volume growth and its driving effect on the liquid cooling market
Currently, AMD's MI350 and next year's MI450 GPU orders are being signed quickly, and it is expected to capture 15-20% of the AI chip market share next year. These products will be widely available through leading cloud service providers, including major hyperscale clouds and next-generation Neo clouds. Dell, HPE, and Supermicro will also integrate the accelerators into their platforms. Moreover, AMD stated that the MI350 series began mass production and shipment earlier this month, with the first wave of partner server launches and CSP instances expected to hit the market in the third quarter of 2025. Additionally, leading cloud service clients tend to adopt the liquid-cooled versions.
Kres(Suzhou) Power Systems Technology Co., Ltd is an emerging company focused on fluid power solutions, and serve for the markets of Energy, Construction, Agriculture, Manufacturing, Transportation, Medical, Data Centers, etc., and was founded in 2022 with leading-edge engineering capabilities and innovative products to keep up with the changing customer needs. Including OCP standard UQD, UQDB, BMQC, manifold, EPDM hose and hose assemblies, FF9 full flow dual interlock quick disconnect coupling (a better replacement for FD83 series products), API heat transfer products, Gates EPDM hose and Wika products.
KRES FF9 connectors are specifically engineered for fluid transmission, electronic cooling, and data center liquid cooling applications, where full flow, fluid compatibility, and safety are of paramount importance. The FF9 series ball valve quick-disconnect couplings adopt a full-flow design and are now available in 2-inch, 1.5-inch, and the popular 1-inch sizes. The FF9 double interlock liquid cooling quick-change connector features a swivel structure at its tail, facilitating easy connection and disconnection. Additionally, its two connector halves are completely identical, simplifying maintenance, installation, and service processes.
· 100% full-flow interlock ball valve: The FF9 double interlock ball valve has a diameter of up to 21mm, ensuring large flow while reducing pressure drop, achieving large flow and low pressure drop, and has obtained SGS ROHS reports and Huace performance test reports.
· KRES interlock ball valve adopts a double interlock design with two locking mechanisms to prevent accidental disconnection and ensure data security.
· The FF9 liquid cooling quick-change ball valve has identical connector halves, making maintenance, installation, and service simple.
· As a liquid cooling quick-change ball valve for data centers, it has reliable and stable performance with minimal leakage, meeting the maintenance needs of safe machine relocation or shutdown.
· Standard body material of the liquid cooling quick-change connector: 304 stainless steel, with wide fluid compatibility, and other materials can be provided upon request.
· Standard sealing material of the liquid cooling quick-change connector: EPDM ethylene propylene diene monomer synthetic rubber, and other materials can be provided upon request.
· Operating temperature range of the liquid cooling-specific ball valve: -40℃ ~ 120℃