Liquid Cooling Penetration in AI Data Centers to Exceed 30% by 2025

According to the latest survey data on the liquid cooling industry for AI data centers released by TrendForce, the launch of NVIDIA's GB200 NVL72 rack-mounted servers in 2025 will accelerate the upgrade of AI data centers. This will drive liquid cooling from early-stage pilot projects to large-scale adoption. It is projected that the penetration rate of liquid cooling in AI data centers will jump from 14% in 2024 to approximately 33%, and will continue to grow in the future to become the mainstream cooling system for AI data centers.

TrendForce points out that the power consumption of GPUs and ASIC chips in AI data centers continues to rise. The NVIDIA GB200/GB300 NVL72 has a rack-level TDP of 130–140KW, making air cooling increasingly unable to meet its heat dissipation needs. This has promoted the application of current Liquid-to-Air (L2A) heat dissipation technology. However, L2A is more of a trade-off due to the limitations of current data center infrastructure and water circulation systems. As AI data centers continue to develop, with chip power consumption and system density rising further, Liquid-to-Liquid (L2L) heat dissipation technology will gradually replace L2A by 2027.

Major U.S. cloud service providers are increasing their investments in AI infrastructure. Led by Google, AWS, and Microsoft, cloud service providers are deploying liquid-cooled AI data centers across North America, Europe, Asia, and other regions.

TrendForce also notes that the rise of liquid cooling in AI data centers has driven demand for related components. Cold plates, as core components for direct-contact heat exchange, are supplied by Cooler Master, AVC, BOYD, and Auras. Except for BOYD, the other three suppliers have expanded production capacity at their factories in Southeast Asia. Coolant distribution units are divided into Sidecar and in-row types. Sidecar coolant distribution units are led by Delta, while in-row units are dominated by Vertiv and BOYD. In-row units offer stronger cooling performance in comparison.

Quick-connect fittings are components that ensure airtightness, pressure resistance, and reliability in liquid cooling systems. In NVIDIA's GB200 projects, companies such as CPC, Parker Hannifin, Danfoss, and Staubi have gained a first-mover advantage.

Kres(Suzhou) Power Systems Technology Co., Ltd is an emerging company focused on fluid power solutions, and serve for the markets of Energy, Construction, Agriculture, Manufacturing, Transportation, Medical, Data Centers, etc., and was founded in 2022 with leading-edge engineering capabilities and innovative products to keep up with the changing customer needs. Including OCP standard UQD, UQDB, BMQC, manifold, EPDM hose and hose assemblies, FF9 full flow dual interlock quick disconnect coupling (a better replacement for FD83 series products), API heat transfer products, Gates EPDM hose and Wika products.

KRES FF9 connectors are specifically engineered for fluid transmission, electronic cooling, and data center liquid cooling applications, where full flow, fluid compatibility, and safety are of paramount importance. The FF9 series ball valve quick-disconnect couplings adopt a full-flow design and are now available in 2-inch, 1.5-inch, and the popular 1-inch sizes. The FF9 double interlock liquid cooling quick-change connector features a swivel structure at its tail, facilitating easy connection and disconnection. Additionally, its two connector halves are completely identical, simplifying maintenance, installation, and service processes.

· 100% full-flow interlock ball valve: The FF9 double interlock ball valve has a diameter of up to 21mm, ensuring large flow while reducing pressure drop, achieving large flow and low pressure drop, and has obtained SGS ROHS reports and Huace performance test reports.

· KRES interlock ball valve adopts a double interlock design with two locking mechanisms to prevent accidental disconnection and ensure data security.

· The FF9 liquid cooling quick-change ball valve has identical connector halves, making maintenance, installation, and service simple.

· As a liquid cooling quick-change ball valve for data centers, it has reliable and stable performance with minimal leakage, meeting the maintenance needs of safe machine relocation or shutdown.

· Standard body material of the liquid cooling quick-change connector: 304 stainless steel, with wide fluid compatibility, and other materials can be provided upon request.

· Standard sealing material of the liquid cooling quick-change connector: EPDM ethylene propylene diene monomer synthetic rubber, and other materials can be provided upon request.

· Operating temperature range of the liquid cooling-specific ball valve: -40℃ ~ 120℃