Rubin Enters Mass Production Ahead of Schedule! 100% All-Liquid Cooling, Fanless & Hose-Free Design — The Demand for Liquid Cooling Is Set to Surge!

At this year's CES, NVIDIA CEO Jensen Huang announced that the company's highly anticipated next-generation Rubin data center products will hit the market this year. At that time, customers will be able to test this technology, thereby helping to accelerate the development of artificial intelligence (AI). Huang Renxun stated that all six new Rubin chips have been retrieved from manufacturing partners and have passed a number of key tests, which indicates that these chips are progressing as planned and can be delivered to customers.

In terms of liquid cooling, NVIDIA showcased its entire lineup of Rubin architecture-based servers and switches in one go this time. Below, we provide a detailed breakdown focusing on the liquid cooling segment.

The Rubin architecture features a redesigned Compute Tray, which is engineered to simplify the highly complex assembly process：100% All-Liquid Cooling Design: Rubin has achieved a transition from approximately 80% liquid cooling in its predecessor to 100% liquid cooling, with fans completely eliminated inside the chassis. The Rubin architecture adopts the GB300 solution, completely doing away with traditional EPDM rubber hoses and continuing to utilize stainless steel corrugated pipes. Cold Plate Architecture，Rubin employs a large cold plate module solution similar to that of the GB200, where a single large cold plate covers a combination of 1 CPU + 2 GPUs.

For the switch segment, the Rubin switch solution shares a similar architecture with the GB300, where small cold plates are fitted over the switch ASIC chips to enable full-coverage liquid cooling, with one small cold plate dedicated to each individual ASIC chip. In addition to the Rubin switches, NVIDIA has also launched the Spectrum-X CPO switches, which also adopt an all-liquid cooling architecture. As illustrated in the images, the liquid cooling architecture is highly complex — even components such as the optical modules are covered with copper cold plates, underscoring a clear trend toward all-liquid cooling architectures.

Relevant information on the Rubin NV72 and Rubin SuperPod

At present, ecosystem partners associated with the Rubin platform have begun to follow suit. Manufacturers including Foxconn, Quanta, Wistron, Dell and Supermicro have all announced that they will leverage their proprietary liquid cooling solutions and manufacturing capabilities to take the lead in becoming part of the server ecosystem for the Rubin architecture.

Gianter Fluid Power Technology (Suzhou) Co., Ltd. is committed to providing complete liquid cooling fluid system solutions and services for data center industry clients. Its product portfolio includes OCP-standard UQD, UQDB and BMQC quick-disconnect couplings, manifold assemblies, EPDM hoses and hose assemblies, FF9 full-flow double-interlock quick-disconnect ball valves (which are direct equivalents of the FD83 series products), American API heat exchangers, American Gates data center-dedicated EPDM hoses, German WIKA pressure gauges and sensors, etc.